January 10, 2024
THERM-A-GAP-GEL
This THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.
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January 10, 2024
This THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.
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January 10, 2024
UWB (Ultra-Wideband) is known for it's wide channel coverage (at least 500Mhz) and the operating...
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January 10, 2024
U201C module based on NXP SR040 (UWB) and NXP QN9090 ( MCU+ BLE) chipset, it contains UWB transceiver,...
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January 10, 2024
U202C module based on NXP SR 150 (UWB) and NXP QN9090 MCU+ BLE) chipset, it contains UWB transceiver,...
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January 10, 2024
W601C modules designed base on NXP 88W8987 chip solution, The SOC module is a highly intelligent platform...
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January 10, 2024
W602C modules designed base on NXP 88W8997 CSP, complied with IEEE 802.11a/b/g/n/ac. 2.4/5GHz RF/PA/LNA...
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January 9, 2024
W603C is a highly integrated Wi Wi-Fi module which is based on the NXP SoC 88W8987eWLP, featuring a 1x1...
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January 9, 2024
PRECISE AND DURABLE IDC CONNECTION WITH DUPLEX PLATING AND DUAL POLARIZATION FCI Basics Quickie® is...
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January 9, 2024
Ruggedized D-sub connectors with die cast housings and IP67 sealing for Harsh Environment applications, provide reliable performance in extreme conditions for the most demanding applications, and mate with standard...
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