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KEMET was founded in 1919 and, with its 100 years of technological innovation, they were able to position themselves as a powerhouse of electronic passive components with a leading product portfolio of polymer, tantalum, ceramic, film and electrolytic capacitors, chip resistors, circuit protection as well as magnetics, sensors, actuators and inductors. On June 15, 2020, KEMET was acquired by YAGEO Corporation.
KEMET’s extensive portfolio of capacitors covers 96% of all dielectric options available that find usage in automotive, industrial, telecommunications, defense, and consumer electronics.

SMD Chip

  • Extremely low ESR and ESL
  • High thermal stability
  • High ripple current capability
  • Lead (Pb)-free, RoHS, and REACH compliant
Radial
  • Conformally coated
  • Radial leaded form factor
  • Lead (Pb)-free, RoHS, and REACH compliant
Radial Disc
  • Preformed (crimped) or straight lead configurations
  • Lead(Pb)-free and RoHS Compliant
  • Halogen-free
  • Non-polar device, minimizing installation concerns
Axial
  • Axial leaded form factor
  • Conformally coated
  • 100% pure matte tin-plated lead finish allowing for excellent solderability
  • SnPb-plated lead finish option available upon request (Sn60/Pb40)
Leaded Stacked Chip
  • Straight Pin lead wires for “through-hole” mounting
  • Industrial grade
  • High frequency performance and bulk capacitance in a reduced footprint
  • Low ESR and ESL
  • High thermal stability
  • High ripple current capability
SMD Array
  • Superior flex performance (up to 5 mm)
  • Saves both circuit board and inventory space
  • Reduces placement costs and increases throughput
  • Lead (Pb)-free, RoHS and REACH compliant
  • Non-polar device, minimizing installation concerns
  • 100% pure matte tin-plated termination finish allowing for excellent solderability
  • SnPb termination finish option available upon request (5% Pb minimum)
  • Commercial and Automotive (AEC-Q200) grades available
  • High shock and vibration capability
  • High thermal stability
  • Encapsulation meets flammability standard UL 94 V–0
  • Industry-leading CV values
  • Low ESR and ESL
  • Non-polar device, minimizing installation concerns
  • Lead (Pb)-free, RoHS, and REACH compliant
  • Surface mountable using standard MLCC reflow profiles
  • Flexible termination option available
  • Reliable and robust termination system
  • Higher capacitance in the same footprint
  • Potential board space savings

SMD Chip

  • Meets or exceeds EIA Standard 535BAAC
  • Tape & Reel standard packaging per EIA 481
  • Symmetrical, compliant terminations
  • Optional gold-plated terminations
  • Laser-marked case
  • Halogen free epoxy
  • Extended range values
  • Low profile case sizes
  • RoHS compliant and lead-free terminations

Radial

  • Taped and reeled per EIA Specification RS-468
  • Laser-marked case

Stacked Chip

  • Polymer cathode technology
  • High capacitance
  • Surface mountable
  • Capacitance values of 20 – 8,000 µF
  • Capacitance can be custom specified
  • Voltage ratings of 3 – 63 VDC
  • High volumetric efficiency
  • Ultra low ESR
  • Surge capability

Axial

  • Taped and reeled per EIA Specification RS–296
  • Laser-marked case

Axial Hermetic

  • Taped and reeled per EIA Specification RS–296
  • Marking per MIL–STD–1285
  • Qualified to MIL–PRF–39003 (CSR13 Style)

Radial Molded

  • Taped and reeled per EIA Specification RS-468
  • Laser-marked case

Radial Three Lead

  • Taped and reeled per EIA Specification RS-468
  • Laser-marked case
  • Tolerances of ±20% and ±10% (special order only)

Radial Assemblies

  • Extremely low and stable ESR (as low as 15 mΩ)
  • High frequency capacitance retention
  • Low temperature capacitance stability
  • High ripple current capability (17,500 mArms)
  • High inrush current capability
  • Excellent power dissipation capability
  • Stackable packaging
  • Mechanically robust assembly and epoxy housing
  • Operates at up to 80% rated voltage
  • Customized solutions available

Radial

  • Self-healing
  • Low loss
  • Low ESL
  • Low profile dimensions available
  • High ripple current
  • High capacitance density
  • High contact reliability
  • Suitable for high frequency applications
  • Automotive Grades (AEC-Q200)

Can

  • Controlled self-healing
  • Low loss
  • High ripple current
  • High capacitance density
  • Long lifetime

SMD Chip

  • RoHS Compliant and lead-free terminations
  • Climatic category: 55/125/56
  • Automotive (AEC–Q200) grades available

Axial

  • RoHS Compliant and lead-free terminations
  • Tape & Reel packaging in accordance with IEC 60286–1
  • Self-Healing
  • Automotive grade (AEC–Q200)

Door Knob

  • Strong mounting
  • High ripple current
  • Medium frequency tuning
  • Low inductance
  • Self-healing

Dual-In-Line

  • Climatic category: 55/125/56
  • RoHS compliant and lead-free terminations

SMD Can

Radial, Radial Pin, & Radial Molded

Snap-In

  • Surface mount without holder
  • Maintenance free
  • Highly reliable against liquid leakage
  • Lead-free and RoHS Compliant

SMD

  • Metal composite powder
  • Shielded construction, SMD configuration
  • Low acoustic noise
    Low magnetic flux leakage

Through-Hole

  • Drum core construction
  • Nickel-zinc (NiZn) ferrite core
  • Magnetic non-shield type
  • Available in Tape and Reel
  • RoHS compliant