Gennex

Data Center Components: Reliable Solutions for IT Facilities

End-to-End Data Center Components with Gennex

Data centers face constant challenges in maintaining power efficiency, connectivity, security, and thermal management. Data Center Components play a critical role in addressing these demands. Gennex, as an authorized distributor of leading tech manufacturers, provides comprehensive solutions to help data centers optimize operations.

Through trusted products from MPS, Amphenol, HellermannTyton, X-PHY/Flexxon, SmartKeeper, and TTS, Gennex supports engineers, IT managers, and procurement teams in creating reliable, efficient, and secure infrastructure.

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Top Brand Solutions for Data Center Components

Power Solutions for Data Centers

MPS (Monolithic Power Systems) offers high-performance power solutions designed to meet the demanding needs of modern IT infrastructure. From Power Management ICs that ensure efficient voltage regulation, to DC-DC Converters that deliver stable, energy-saving power distribution, and Current Sensors that enable real-time monitoring and load management — MPS products help data centers maximize uptime, reduce energy loss, and enhance operational reliability.

General Specs and Capabilities:

 
  • Input voltage range typically from 3 V to 16 V, suitable for server and rack power rails.
  • Supports multiple step-down DC/DC channels (up to 4–6) for efficient multi-rail regulation.
  • Output currents up to 6 A per channel for high-density, low-voltage applications.
  • High switching frequencies up to 2 MHz allow smaller passive components and compact designs.
  • Built-in protection features such as Over-Current Protection (OCP), Under-Voltage Lock-Out (UVLO), and Thermal Shutdown ensure system safety.
  • Compact QFN-type packages (around 5 mm × 5 mm) reduce PCB footprint.
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General Specs and Capabilities:

 
  • Designed for 48 V data center architectures, converting to intermediate bus voltages (e.g., 6 V or 12 V).
  • Conversion efficiency exceeding 96–97%, reducing heat and overall power loss.
  • Output currents up to 6 A per channel for high-density, low-voltage applications.
  • High power density (up to 1,500–1,700 W/in³) for space-constrained rack environments.
  • Compact footprint, typically under 30 mm × 20 mm × 7 mm, enabling flexible board placement.
  • Optimized for digital control and telemetry, supporting system-level power monitoring and remote configuration.
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General Specs and Capabilities:

 
  • Magnetic and Hall-effect current sensing technologies for non-intrusive, accurate current measurement.
  • Wide current-measurement ranges suitable for both low-voltage server rails and high-voltage distribution lines.
  • Fast response times (<1 µs)for real-time monitoring and protection.
  • High power density (up to 1,500–1,700 W/in³) for space-constrained rack environments.
  • Integrated signal conditioning and amplification minimize noise and enhance accuracy.
  • Available in compact SOIC or DFN packages for easy integration on dense PCBs.
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High-Speed Connectivity and Interconnect Solutions

Amphenol provides cutting-edge data center components designed to support high-speed data transmission and robust power delivery in today’s high-performance IT environments. With a wide range of connectors and interconnect systems, Amphenol enables reliable server-to-server communication, optimized power distribution, and scalable architecture—making them essential to modern data center infrastructure.

PwrMAX® Power Connector:

  • Current rating: up to 100 A per contact for high-density DC architectures.

  • Configurations: coplanar, backplane, mezzanine, orthogonal.

  • Features: reduced board depth (-18 %) and increased blind-mate gather ability.
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Minitek® 12VHPWR & PCIe Gen5 Connector System:

  • Rated current: up to 9.5 A per contact, supports high-power GPU/data-center cards.

  • Contact resistance: low (max 5 ) for signal and power integrity.
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OSFP / Backplane Solutions:

  • Data-throughput supports up to 112 Gb/s backplane interconnects, linear transmission beyond 40 GHz.

  • Design: high-density board-to-board with 0.6 mm contact pitch for 1U rack applications.
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Active Optical Cable (AOC) – QSFP DD 200G:

  • Aggregate bandwidth: up to 200 Gb/s per assembly for high-capacity data links

  • Reach: up to 100 m over parallel multimode fiber (OM3/OM4).

  • Design: 8-channel lanes, doubles port density compared to QSFP28.
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Fiber Optic Transceivers – SFP & XFP Families:

  • Speed examples: 1.25 Gb/s to 14 Gb/s; supports Duplex, BiDi, CWDM, DWDM

  • Link length: up to 80 km on single-mode fiber for long-haul or campus data center links.
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Cable Assemblies – High-Speed & High-Power:

  • Supports data center, networking and high-performance systems for speeds up to 300 Gb/s.

  • Jacket: typically LSZH or plenum rated; fibers: 24-core multimode for density and signal integrity.
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Structured Cable Systems – Racks & Harnesses:

  • Custom multi-branch assemblies for large systems; optimized for high-density rack environments.
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Smart Cable Management Systems

HellermannTyton delivers smart data center components focused on efficient cable management, essential for maintaining airflow, serviceability, and system reliability. From durable cable labels to high-strength routing solutions and structured cable trays, their products help data centers stay organized, scalable, and thermally optimized.

General Specs and Capabilities:

  • Material: Durable polymers (e.g., UV-resistant polyurethane or polyester) 

  • Print Compatibility: Thermal-transfer or laser print formats.

  • Markers per Sheet: Typical bundles of several hundred to a few thousand 

  • Resistance: Abrasion, dirt, and moisture resistant 
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General Specs and Capabilities:

  • Cable Tie Tensile Strength: Range from ~18 lb (≈ 80 N) to ~250 lb (≈ 1,110 N) depending on environment 

  • Materials: High-temperature/UV-stable polyamides and specialty compounds

  • Bundle Diameter Range: Suitable for small clusters to large cable bundles (≈ Ø1.5 mm to Ø150 mm)  

  • Mounting Options: Clips, edge-mounts, adhesive or screw-fix 
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General Specs and Capabilities:

  • Port Density Support: High-density packaging (e.g., 48–576 ports per rack unit) 

  • Bend Radius Control: Minimum advisable radius often ≥ 30 mm for high-speed cables 

  • Material Enclosure: Options for indoor/outdoor, IP-rated protection (e.g., IP55) 

  • Mount Geometry: Designed for rail, overhead, floor, or rack-mounted systems 
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Cybersecurity at the Hardware Level

X-PHY with Flexxon delivers advanced data center components that integrate cybersecurity directly at the hardware level. With AI-embedded SSDs and encrypted storage devices, their solutions provide real-time threat detection, tamper resistance, and secure data storage—critical for safeguarding sensitive information in high-density, high-security data center environments.

General Specs and Capabilities:

  • Interface: PCIe NVMe (Gen3×4 or higher) 

  • Form Factors: M.2, U.2, or other enterprise-grade modules 
  • Embedded Security Engines: AI or machine-learning co-processor monitoring firmware/firmware behavior 

  • Physical/Hardware Sensors: Tamper detection, intrusion monitoring, temperature/power anomaly detection 
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Physical Port Security

SmartKeeper provides specialized data center components focused on physical port security, helping prevent unauthorized access to critical IT infrastructure. With device locks, rack security kits, and access control systems, SmartKeeper enables data centers to secure ports, maintain compliance, and reduce physical security vulnerabilities—without compromising serviceability.

General Specs and Capabilities:

  • Port Compatibility: USB-A/B, HDMI, DisplayPort, RJ-45, SFP/QSFP fiber optics 

  • Security Mechanism: Custom key pattern or master-key system for controlled access 

  • Material: Metal or antistatic polymer, rated for IT-rack environments (operating temp. ~-20 °C to +60 °C) 

  • Locking Features: Serial-number tracking, tamper-evident seals, tool-free installation 
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Precision Cooling Solutions

TTS (Laird Thermal Systems) delivers precision-engineered data center components for thermal management, ensuring reliable performance in high-density environments. Their advanced cooling units, heat exchangers, and temperature monitoring sensors help data centers maintain optimal operating conditions, prevent overheating, and extend hardware lifespan.

General Specs and Capabilities:

  • Cooling Capacity: Designed to handle high-density racks, often rated in the tens of kW per rack. 

  • Form Factor: Rack-mounted, in-row or overhead units compatible with standard server cabinet widths. 

  • Interface: Supports integration with building management systems (BMS) for monitoring/automation.

  • Temperature Stability: Maintains tight temperature tolerances (e.g., ±1 °C) under variable load.
     
  • Scalability: Modular design allows for cascading or mirrored units for growing facility needs. 
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General Specs and Capabilities:

  • Fan Performance: High-air-flow fans (e.g., >1,000 CFM) optimized for rack or row-level use; low acoustic and high MTBF. 

  • Heat Exchanger Types: Air-to-air, liquid-to-air or liquid-to-liquid units; thermal capacity often exceeds several kW. 

  • Material: Fin-and-tube or micro-channel designs with corrosion-resistant materials; passive and active options. 
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General Specs and Capabilities:

  • Sensor Types: Digital sensors for temperature, humidity, coolant flow, pump status, rack-inlet/outlet differential. 

  • Measurement Precision: High accuracy (e.g., ±0.1 °C), fast response times (< 1 s) for real-time monitoring. 

  • Connectivity: Supports standard protocols (SNMP, Modbus, BACnet) and offers remote alerts/telemetry. 

  • Form Factor: Rack or panel-mounted units, often with LCD/read-out and alarm output. 
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Why These Solutions Matter in Data Centers

Maximized Uptime

Reliable power management, efficient cooling, and secure connectivity minimize system failures and unplanned outages.

Optimized Power Efficiency

Advanced ICs, converters, and thermal systems reduce energy consumption, lowering operational costs.

Enhanced Data Security

Hardware-level protection and physical access control from SmartKeeper strengthen cybersecurity from the inside out.

Improved Network Performance

Amphenol’s high-speed connectors and cable systems ensure uninterrupted, low-latency data transfer

Organized Infrastructure

HellermannTyton’s structured cable management improves airflow, maintenance efficiency, and troubleshooting speed.

Scalable and Future-Ready

Each solution supports the growing demands of modern IT facilities — from AI-driven workloads to expanding rack density.

Trusted Global Brands, Local Expertise

With Gennex as the authorized distributor, businesses gain access to world-class technologies backed by local support and technical integration.

Compliance and Reliability

All brands meet international data center standards, ensuring safe, efficient, and long-term operations.

Why Partner with Gennex for Data Center Components?

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Gennex solutions cover every essential aspect of data center components from power management and connectivity to cybersecurity, cable organization, and precision cooling.

With our technical expertise, local support, and genuine product sourcing, we help data centers in building infrastructures that are efficient, secure, and future-ready. Whether you’re designing a new facility or upgrading existing systems, Gennex ensures you get the right products with proven performance and long-term reliability.

Ready to optimize your data center? Contact Gennex today at contact@gennexcorp.com.