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Data Center Components: Reliable Solutions for IT Facilities
End-to-End Data Center Components with Gennex
Data centers face constant challenges in maintaining power efficiency, connectivity, security, and thermal management. Data Center Components play a critical role in addressing these demands. Gennex, as an authorized distributor of leading tech manufacturers, provides comprehensive solutions to help data centers optimize operations.
Through trusted products from MPS, Amphenol, HellermannTyton, X-PHY/Flexxon, SmartKeeper, and TTS, Gennex supports engineers, IT managers, and procurement teams in creating reliable, efficient, and secure infrastructure.
Power Solutions for Data Centers
MPS (Monolithic Power System) offers high-performance power solutions designed to meet the demanding needs of modern IT infrastructure. From Power Management ICs that ensure efficient voltage regulation, to DC-DC Converters that deliver stable, energy-saving power distribution, and Current Sensors that enable real-time monitoring and load management — MPS products help data centers maximize uptime, reduce energy loss, and enhance operational reliability.
General Specs and Capabilities:
- Input voltage range typically from 3 V to 16 V, suitable for server and rack power rails.
- Supports multiple step-down DC/DC channels (up to 4–6) for efficient multi-rail regulation.
- Output currents up to 6 A per channel for high-density, low-voltage applications.
- High switching frequencies up to 2 MHz allow smaller passive components and compact designs.
- Built-in protection features such as Over-Current Protection (OCP), Under-Voltage Lock-Out (UVLO), and Thermal Shutdown ensure system safety.
- Compact QFN-type packages (around 5 mm × 5 mm) reduce PCB footprint.
General Specs and Capabilities:
- Designed for 48 V data center architectures, converting to intermediate bus voltages (e.g., 6 V or 12 V).
- Conversion efficiency exceeding 96–97%, reducing heat and overall power loss.
- Output currents up to 6 A per channel for high-density, low-voltage applications.
- High power density (up to 1,500–1,700 W/in³) for space-constrained rack environments.
- Compact footprint, typically under 30 mm × 20 mm × 7 mm, enabling flexible board placement.
- Optimized for digital control and telemetry, supporting system-level power monitoring and remote configuration.
General Specs and Capabilities:
- Magnetic and Hall-effect current sensing technologies for non-intrusive, accurate current measurement.
- Wide current-measurement ranges suitable for both low-voltage server rails and high-voltage distribution lines.
- Fast response times (<1 µs)for real-time monitoring and protection.
- High power density (up to 1,500–1,700 W/in³) for space-constrained rack environments.
- Integrated signal conditioning and amplification minimize noise and enhance accuracy.
- Available in compact SOIC or DFN packages for easy integration on dense PCBs.
General Specs and Capabilities:
- High power density 48 V modules for data centers and high-performance computing.
- Scalable design – parallel modules to build systems over 1 kW.
- Configurable & monitorable via I²C / PMBus interface.
- Complete 48V-to-processor solution – includes both ICs and modules.
- LLC architecture – supports up to 2× peak current for transient performance.
General Specs and Capabilities:
- Scalable solutions beyond 2 kW system power capability.
- Advanced fault & sense reporting for current and temperature.
- Independent phase outputs for added design flexibility.
- Modules integrate DrMOS + inductor + capacitors + MPS’s Intelli-Phase™ chip with Quiet Switcher™ (QST) technology
General Specs and Capabilities:
- “Accusense”: 3% current-sense accuracy across full temperature range.
- Enables high switching frequency → allows smaller inductors and reduced inductance values.
- Compact packages yet capable of high current handling.
- Designed for processor-core power rails in data-center applications, using integrated high-side & low-side FETs plus drivers.
General Specs and Capabilities:
- Digital Constant-On-Time (COT) control for very fast transient response.
- Single control parameter for loop compensation (“digital ramp”).
- High efficiency multi-phase controller with dynamic current balance among phases.
- Interfaces supported: PMBus / I²C, PWM-VID, SVI2/3, AVSBus depending on variant.
- Designed for processor core rails (CPUs/GPUs/ASICs) in data center and high-performance computing applications.
General Specs and Capabilities:
- Rigorous testing to ensure reliable operation in challenging data-center environments.
- Designed to save board space: balanced for minimal output capacitance while maintaining high efficiency and fast transient response.
- Easy-to-use features that simplify system design and reduce PCB layout complexity.
General Specs and Capabilities:
- Monolithic structure with integrated key components (MOSFETs, control, sensing).
- High-accuracy current monitoring/reporting (IMON) for system power/energy management.
- Support for stack/parallel operation for high-current applications.
- Designed to reduce design complexity: minimal external components, simplified PCB layout.
High-Speed Connectivity and Interconnect Solutions
Amphenol provides cutting-edge data center components designed to support high-speed data transmission and robust power delivery in today’s high-performance IT environments. With a wide range of connectors and interconnect systems, Amphenol enables reliable server-to-server communication, optimized power distribution, and scalable architecture—making them essential to modern data center infrastructure.
PwrMAX® Power Connector:
- Current rating: up to 100 A per contact for high-density DC architectures.
- Configurations: coplanar, backplane, mezzanine, orthogonal.
- Features: reduced board depth (-18 %) and increased blind-mate gather ability.
Minitek® 12VHPWR & PCIe Gen5 Connector System:
- Rated current: up to 9.5 A per contact, supports high-power GPU/data-center cards.
- Contact resistance: low (max 5 mΩ) for signal and power integrity.
OSFP / Backplane Solutions:
- Data-throughput supports up to 112 Gb/s backplane interconnects, linear transmission beyond 40 GHz.
- Design: high-density board-to-board with 0.6 mm contact pitch for 1U rack applications.
Active Optical Cable (AOC) – QSFP DD 200G:
- Aggregate bandwidth: up to 200 Gb/s per assembly for high-capacity data links
- Reach: up to 100 m over parallel multimode fiber (OM3/OM4).
- Design: 8-channel lanes, doubles port density compared to QSFP28.
Fiber Optic Transceivers – SFP & XFP Families:
- Speed examples: 1.25 Gb/s to 14 Gb/s; supports Duplex, BiDi, CWDM, DWDM
- Link length: up to 80 km on single-mode fiber for long-haul or campus data center links.
Cable Assemblies – High-Speed & High-Power:
- Supports data center, networking and high-performance systems for speeds up to 300 Gb/s.
- Jacket: typically LSZH or plenum rated; fibers: 24-core multimode for density and signal integrity.
Structured Cable Systems – Racks & Harnesses:
- Custom multi-branch assemblies for large systems; optimized for high-density rack environments.
BarKlip® I/O (Board / Cable / Busbar Interface):
- Current Rating per Contact: Typically up to 100 A in compact 1U rack form-factor for I/O power distribution.
- Contact Resistance (Max): Around 0.3 mΩ (end-of-life spec) for minimal power loss.
- Busbar/Connector Mating Thickness: Commonly around 6.0 mm ±0.1 mm for direct busbar connection.
- Operating Temperature Range: Approximately -40 °C to +105 °C (housing and contact environment).
- Mounting/Integration Features: Floating panel mount or blind-mate capability to accommodate rack alignment tolerances.
Board / Busbar-Mounted BarKlip® Connectors:
- Current Rating per Contact: ~150–450 A+ depending on connector series and busbar size.
- Contact Resistance (End-of-Life): ~0.1–0.2 mΩ for low power loss and heat generation.
- Voltage Rating: Up to several hundred volts (e.g., 480 V DC in OCP-compatible versions).
- Operating Temperature: −40 °C to +105 °C or higher, based on materials used.
- Mounting Tolerance: Floating-mount design with ±3 mm misalignment capability for blind-mate racks.
- Material/Plating: High-conductivity copper alloy with silver or gold plating for durability and performance.
BarKlip® for Open Compute Project (OCP):
- Current Rating per Contact: ~150–450 A+ depending on connector series and busbar size.
- Contact Resistance (End-of-Life): ~0.1–0.2 mΩ for low power loss and heat generation.
- Voltage Rating: Up to several hundred volts (e.g., 480 V DC in OCP-compatible versions).
- Operating Temperature: −40 °C to +105 °C or higher, based on materials used.
- Mounting Tolerance: Floating-mount design with ±3 mm misalignment capability for blind-mate racks.
- Material/Plating: High-conductivity copper alloy with silver or gold plating for durability and performance.
Power Into Rack Input:
- OCP Compatibility: Fully compatible with OCP Rack & Power architectures, including ORv3, for standardized input power distribution.
- Connector Design: Slim 7-pin AC input connectors and cable assemblies for efficient busbar-to-power-shelf routing.
- Electrical Flexibility: Configurable for various voltage and current ratings to suit different rack power needs.
- High Current Support: Handles up to hundreds of amps per contact for 48 V rack systems.
- Integration Options: Plug-and-play design with PCB, crimped, or hybrid terminations and low-profile strain relief for dense rack layouts.
Power Supply Unit / Battery Backup Unit (PSU/BBU):
- High-Performance Design: Built for high-current, high-density power distribution in modern data-center racks.
- Power & Backup Integration: Supports PSUs and BBUs with hot-swap capability, high reliability, and low contact resistance.
- OCP Compliance: Compatible with OCP Rack & Power standards, including ORv3 and 54 V rack-level architectures.
- Compact & Modular: Space-efficient form factors optimize airflow, minimize footprint, and simplify rack integration.
- Operational Resilience: Designed for surge, backup, and continuous operation to ensure uninterrupted power during mains outages.
Server:
- Designed for servers in HPC, cloud & AI racks where high-bandwidth, low-latency connectivity is essential.
- Offers interconnect solutions (power + signal) optimized for server board architecture: memory, I/O, accelerator modules, storage.
- Supports next-generation protocols and standards: e.g., PCIe® Gen 5/6, CXL, EDSFF, high-speed card-edge connectors.
- Emphasis on reliability, density, and performance in server environments (1U/2U/scale-out racks).
Storage:
- High-speed connectors for HDD, SSD, SAN, NAS, and DAS in modern data centers.
- Support PCIe (up to 32 Gb/s), SAS (24 Gb/s), SATA (12 Gb/s), and PCIe Gen 5 signaling.
- Durable with ~500 mating cycles; hot-plug capable.
- Compact, high-density board-to-board and hybrid power/signal connectors (0.6 mm pitch).
- Built for reliable, high-bandwidth storage backplanes with RAID support and optimized thermal and signal integrity.
Network Module:
- Core components for data center switching and routing, enabling seamless device connectivity within racks.
- Support efficient, reliable network operations and diverse network interconnections.
- High-speed data transfer with support for 112 Gb/s and 224 Gb/s backplane cables and interconnects.
- Designed for low latency, high signal integrity, and robustness in high-density data center network environments.
- Advanced interconnect solutions supporting data routing and switching functions in rack-scale architectures.
112 G & 224 G Inter‑Rack Connectivity:
- Supports ultra‑high data‑rate inter‑rack links up to 112 Gb/s and 224 Gb/s.
- Available in pluggable, cable assembly, and backplane form‑factors.
- Engineered for low insertion loss, high density, and excellent signal integrity.
- Designed for hyperscale data centers, HPC networking and rack‑scale architectures.
- Scalable & backwards compatible to lower‑rate systems for future‑proofing.
Intra Rack Cabling:
- High-Speed Performance: Supports 112 Gb/s per lane (PAM4), with advanced versions reaching 224 Gb/s for next-gen data rates.
- Cable Options: Passive copper (up to 2 m) or active copper/optical (up to 4 m+), balancing reach and signal quality.
- Design Specs: Uses 25–32 AWG conductors with ~93 Ω impedance for optimal high-speed transmission.
- Thermal & Mechanical: Rated −40 °C to +85 °C for reliable operation in dense rack environments.
- Application Focus: Ideal for short intra-rack connections requiring low latency, high integrity, and efficient airflow.
- Future-Ready: Backward compatible with PCIe Gen5 and prepared for emerging 112/224 Gb/s standards.
Smart Cable Management Systems
HellermannTyton delivers smart data center components focused on efficient cable management, essential for maintaining airflow, serviceability, and system reliability. From durable cable labels to high-strength routing solutions and structured cable trays, their products help data centers stay organized, scalable, and thermally optimized.
General Specs and Capabilities:
- Material: Durable polymers (e.g., UV-resistant polyurethane or polyester)
- Print Compatibility: Thermal-transfer or laser print formats.
- Markers per Sheet: Typical bundles of several hundred to a few thousand
- Resistance: Abrasion, dirt, and moisture resistant
General Specs and Capabilities:
- Cable Tie Tensile Strength: Range from ~18 lb (≈ 80 N) to ~250 lb (≈ 1,110 N) depending on environment
- Materials: High-temperature/UV-stable polyamides and specialty compounds
- Bundle Diameter Range: Suitable for small clusters to large cable bundles (≈ Ø1.5 mm to Ø150 mm)
- Mounting Options: Clips, edge-mounts, adhesive or screw-fix
General Specs and Capabilities:
- Port Density Support: High-density packaging (e.g., 48–576 ports per rack unit)
- Bend Radius Control: Minimum advisable radius often ≥ 30 mm for high-speed cables
- Material Enclosure: Options for indoor/outdoor, IP-rated protection (e.g., IP55)
- Mount Geometry: Designed for rail, overhead, floor, or rack-mounted systems
Cybersecurity at the Hardware Level
X-PHY with Flexxon delivers advanced data center components that integrate cybersecurity directly at the hardware level. With AI-embedded SSDs and encrypted storage devices, their solutions provide real-time threat detection, tamper resistance, and secure data storage—critical for safeguarding sensitive information in high-density, high-security data center environments.
General Specs and Capabilities:
- Interface: PCIe NVMe (Gen3×4 or higher)
- Form Factors: M.2, U.2, or other enterprise-grade modules
- Embedded Security Engines: AI or machine-learning co-processor monitoring firmware/firmware behavior
- Physical/Hardware Sensors: Tamper detection, intrusion monitoring, temperature/power anomaly detection
Physical Port Security
SmartKeeper provides specialized data center components focused on physical port security, helping prevent unauthorized access to critical IT infrastructure. With device locks, rack security kits, and access control systems, SmartKeeper enables data centers to secure ports, maintain compliance, and reduce physical security vulnerabilities—without compromising serviceability.
General Specs and Capabilities:
- Port Compatibility: USB-A/B, HDMI, DisplayPort, RJ-45, SFP/QSFP fiber optics
- Security Mechanism: Custom key pattern or master-key system for controlled access
- Material: Metal or antistatic polymer, rated for IT-rack environments (operating temp. ~-20 °C to +60 °C)
- Locking Features: Serial-number tracking, tamper-evident seals, tool-free installation
Precision Cooling Solutions
Tark Thermal Solutions, formerly known as Laird Thermal Systems, delivers precision-engineered data center components for thermal management, ensuring reliable performance in high-density environments. Their advanced cooling units, heat exchangers, and temperature monitoring sensors help data centers maintain optimal operating conditions, prevent overheating, and extend hardware lifespan.
General Specs and Capabilities:
- Cooling Capacity: Designed to handle high-density racks, often rated in the tens of kW per rack.
- Form Factor: Rack-mounted, in-row or overhead units compatible with standard server cabinet widths.
- Interface: Supports integration with building management systems (BMS) for monitoring/automation.
- Temperature Stability: Maintains tight temperature tolerances (e.g., ±1 °C) under variable load.
- Scalability: Modular design allows for cascading or mirrored units for growing facility needs.
General Specs and Capabilities:
- Fan Performance: High-air-flow fans (e.g., >1,000 CFM) optimized for rack or row-level use; low acoustic and high MTBF.
- Heat Exchanger Types: Air-to-air, liquid-to-air or liquid-to-liquid units; thermal capacity often exceeds several kW.
- Material: Fin-and-tube or micro-channel designs with corrosion-resistant materials; passive and active options.
General Specs and Capabilities:
- Application: Temperature-critical environments across various industries
- Cooling Capacity Range: 100 watts to 25,000 watts (25 kW) and beyond
- Temperature Control Range: Capable of maintaining temperatures above, below, or equal to ambient levels
- Durable design for long-term reliability and stable thermal performance
General Specs and Capabilities:
- Centrifugal water pumps engineered for demanding environments with oil‐submersible design and versatile power input.
- Key specs: 125 W output, dual‐voltage input (115/230 V AC), supports 50/60 Hz operation.
- Designed for reliability and long lifespan with low maintenance requirements.
- Global compatibility and “plug‐and‐play” readiness (universal voltage/frequency).
- Suitable for critical applications in imaging, industrial equipment and security scanning systems; adaptable for data‑center cooling loops.
General Specs and Capabilities:
- High-pressure, low-flow regenerative turbine pump for high-density racks and immersion-cooling systems.
- Operating pressure: 600 psi; construction pressure up to 2,500 psi.
- Input voltage: 3‑Phase 400 VAC (50 Hz) / 460 VAC (60 Hz).
- Flow rate: 0–36 GPM; max temperature: 60 °C.
- Wetted materials: ASTM A108 shaft, 4140 housing, 304SS hybrid-ceramic bearings, brass impeller/casing.
- Compatible with refrigerants R134a, R515B, R471A, R1234ze(E), R1234yf.
- Compact, quiet, energy-efficient design with ~80,000 hour life expectancy.
Why These Solutions Matter in Data Centers
Maximized Uptime
Reliable power management, efficient cooling, and secure connectivity minimize system failures and unplanned outages.
Optimized Power Efficiency
Advanced ICs, converters, and thermal systems reduce energy consumption, lowering operational costs.
Enhanced Data Security
Hardware-level protection and physical access control from SmartKeeper strengthen cybersecurity from the inside out.
Improved Network Performance
Amphenol’s high-speed connectors and cable systems ensure uninterrupted, low-latency data transfer
Organized Infrastructure
HellermannTyton’s structured cable management improves airflow, maintenance efficiency, and troubleshooting speed.
Scalable and Future-Ready
Each solution supports the growing demands of modern IT facilities — from AI-driven workloads to expanding rack density.
Trusted Global Brands, Local Expertise
With Gennex as the authorized distributor, businesses gain access to world-class technologies backed by local support and technical integration.
Compliance and Reliability
All brands meet international data center standards, ensuring safe, efficient, and long-term operations.
Why Partner with Gennex for Data Center Components?
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Gennex solutions cover every essential aspect of data center components from power management and connectivity to cybersecurity, cable organization, and precision cooling.
With our technical expertise, local support, and genuine product sourcing, we help data centers in building infrastructures that are efficient, secure, and future-ready. Whether you’re designing a new facility or upgrading existing systems, Gennex ensures you get the right products with proven performance and long-term reliability.